When your workstation or server starts to lag under heavy workloads, the bottleneck is often memory. The Kingston Technology(KF548R36RBK8256), 256 GB, 8 x 32 GB, DDR5, 288-pin DIMM gives you a massive, reliable pool of high-speed RAM that keeps data flowing smoothly, so you can finish projects faster and avoid costly downtime.
Benefits of Kingston Technology DIMM
- Data integrity: ECC detection and correction prevent errors that could corrupt your work.
- Faster processing: 4800 MT/s transfer rate reduces latency for demanding applications.
- Easy upgrade: Plug-N-Play design automatically runs at the highest supported speed.
- Energy efficient: 1.1 V memory voltage lowers power consumption and heat.
- Future-proof: Supports both Intel XMP 3.0 and AMD EXPO profiles for easy overclocking.
Kingston Technology DDR5 DIMM
Owning this memory kit feels like adding a turbocharger to a high-performance engine. Every time you load large datasets, render complex models, or run simulations, the system responds instantly, giving you a smooth, responsive experience. The built-in heatsink keeps temperatures in check, so you can push the limits without worrying about overheating.
Usages of a 256 GB DIMM
The 256 GB capacity is ideal for data-intensive environments such as AI research servers, virtualisation clusters, and high-end workstations that run CAD, video editing, or scientific simulations. It also suits enterprise servers that need reliable, error-correcting memory for critical databases and virtual machines.
Key Features of a 256 GB DIMM
- Capacity: 256 GB. Provides a huge memory pool for large workloads.
- Module configuration: 4096M x 80. Delivers a wide data path for fast access.
- Memory voltage: 1.1 V. Keeps power draw low while maintaining performance.
- CAS latency: 36. Balances speed and stability for demanding tasks.
- On-Die ECC: Yes. Adds an extra layer of error correction inside each chip.
- ECC: Yes. Detects and corrects multi-bit errors for data reliability.
- Cooling type: Heatsink. Helps dissipate heat during intensive use.
- Lead plating: Gold. Ensures strong, corrosion-resistant connections.
- Memory form factor: 288-pin DIMM. Fits standard server and workstation slots.
- Intel XMP version: 3.0. Enables one-click overclocking on compatible platforms.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| Programming power voltage (VPP) |
1.8 V |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row Precharge Time (TRP) |
15.8 |
| Row active time |
29.12 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 80 |
| Memory voltage |
1.1 V |
| Memory ranking |
1 |
| Memory channels |
Octa-channel |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory data transfer rate |
4800 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
8 x 32 GB |
| Internal memory |
256 GB |
| Buffered memory type |
Registered (buffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 95 °C |
| Sustainability |
| Doesn't contain |
Halogen |
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Weight |
173.6 g |
| Height |
31.2 mm |
| Depth |
133.3 mm |
| Width |
3.8 mm |
| Packaging data |
| Package weight |
190.51 g |
| Package height |
35.6 mm |
| Package depth |
167.6 mm |
| Package width |
104.1 mm |
| Other features |
| Internal memory |
256 GB |
