Are you frustrated by lag when you push your PC to its limits?
The Kingston Technology (KF560C36BWEK264), 64 GB, 2 x 32 GB, DDR5, 288-pin DIMM is a high-speed DDR5 memory kit that delivers the bandwidth and stability needed for demanding games, 4K streaming and heavy-duty creative work. It gives you the extra headroom to run the latest titles and professional applications without stutter.
Kingston Technology DDR5 DIMM
Choosing the right DDR5 DIMM can be confusing, especially with many claims about speed and compatibility. Buyers often worry about whether the kit will work with their motherboard or if it can handle overclocking safely. This kit removes the guesswork: it supports Intel XMP 3.0 and AMD EXPO profiles, includes on-die ECC for data integrity, and has a low-profile heat spreader to keep temperatures low, ensuring reliable performance on certified boards.
Key Features of a 64 GB DDR5 DIMM
- Memory capacity: 64 GB. Provides ample room for multitasking and large projects.
- Module configuration: 2 x 32 GB. Lets you populate two slots for balanced dual-channel performance.
- Data transfer rate: 6000 MT/s. Offers very high bandwidth for fast data movement.
- CAS latency: 36. Balances speed and timing for smooth operation.
- Memory voltage: 1.35 V. Optimised power consumption while maintaining performance.
- On-Die ECC: Yes. Helps keep data accurate during intensive workloads.
- Heat spreader: Heatsink. Improves cooling to sustain high speeds.
- Compatibility: Intel XMP 3.0 and AMD EXPO certified. Ensures easy setup on most modern platforms.
- Dimensions: Height 34.9 mm, Width 6.62 mm, Depth 133.3 mm. Fits standard DIMM slots without clearance issues.
Usages of a 64 GB DDR5 DIMM
This memory kit is ideal for gamers who run ultra settings, content creators editing 4K video or 3D models, and professionals who need reliable performance for simulation or data-intensive tasks.
Benefits of Kingston Technology DDR5 DIMM
- Stability: On-die ECC maintains data integrity during heavy use.
- Future-proofing: 6000 MT/s speed keeps you ready for upcoming software demands.
- Ease of upgrade: XMP 3.0 and EXPO profiles simplify overclocking setup.
- Cooling: Low-profile heat spreader keeps temperatures low for long sessions.
- Confidence: Tested and approved by leading motherboard manufacturers.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 64 |
| Memory voltage |
1.35 V |
| Memory ranking |
2 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
70.26 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
64 GB |
