Tired of lag when you push your PC to the limit? Upgrade to Kingston Technology (KF560C30BBEK264), 64 GB, 2 x 32 GB 6000 MT/s DDR5 DIMM RAM and give your system the bandwidth it needs for smooth gaming, streaming and heavy-duty creation. This high-speed DDR5 RAM delivers the capacity and reliability required for the latest titles and demanding applications, keeping you ahead of the competition.
Usages of a 6000 MT/s DDR5 RAM
Whether you are building a new rig or enhancing an existing one, this DDR5 RAM fits neatly into your daily workflow. It powers fast load times for games, handles 4K+ livestreams without stutter, and accelerates rendering tasks in animation or 3D software, letting you stay productive from morning until night.
Benefits of Kingston Technology DDR5 RAM
- Faster performance: 6000 MT/s data rate cuts latency and speeds up game loading.
- Stable overclocking: On-die ECC maintains data integrity even at high speeds.
- Efficient power use: Integrated PMIC supplies just the right voltage, reducing heat.
- Broad compatibility: Intel XMP 3.0 and AMD EXPO profiles work with most modern boards.
- Low-profile cooling: Sleek heat spreader keeps temperatures down without taking up space.
Kingston Technology DDR5 RAM
Choosing this kit means you get more than just raw speed. The dual 32-bit subchannels improve data handling, giving you smoother frame rates and quicker multitasking. With 64 GB of total memory, you can run multiple demanding programs simultaneously without slowdown. The gold-plated leads ensure a reliable connection, while the JEDEC-standard compliance guarantees it will work with any certified motherboard.
The package includes two 32 GB modules, each designed for easy installation. Their compact 6.62 mm height and 34.9 mm thickness let them fit even in tight builds, and the black heat spreader adds a subtle, professional look to your interior.
Key Features of a 6000 MT/s DDR5 RAM
- Memory speed: 6000 MT/s. Provides ultra-fast data transfer for demanding tasks.
- Capacity: 64 GB (2 x 32 GB). Allows extensive multitasking and large project handling.
- Voltage: 1.35 V. Optimises power consumption while maintaining performance.
- CAS latency: 30. Balances speed and stability for smooth operation.
- On-Die ECC: Yes. Protects data integrity during intense workloads.
- Cooling type: Heatsink. Keeps the modules cool under heavy use.
- Form factor: 288-pin DIMM. Fits standard desktop motherboards.
- Compatibility: Intel XMP 3.0 and AMD EXPO certified. Easy overclocking with preset profiles.
- Lead plating: Gold. Ensures a durable, low-resistance connection.
- Dimensions: 34.9 mm H × 133.3 mm D × 6.62 mm W. Fits most cases without clearance issues.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Memory voltage |
1.35 V |
| CAS latency |
30 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
69.18 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
64 GB |
