When your workstation stalls because memory can’t keep up, you need a reliable, high-speed upgrade that won’t compromise data integrity. Kingston Technology (KF556R36RBK8256),256 GB,8 x 32 GB DDR5, 288-pin DIMM,Black is a server-grade DDR5 DIMM kit that delivers massive capacity and overclockable performance while protecting every bit of data.
Kingston Technology DDR5 DIMM
Many buyers worry that high-capacity memory will be difficult to install or will cause instability on demanding platforms. This kit removes that doubt with plug-and-play auto-overclocking, certified XMP 3.0 and AMD EXPO profiles, and full ECC support, ensuring a smooth, error-free experience on the latest Intel® and AMD workstations.
Key Features of a 256 GB DDR5 DIMM
- Capacity: 256 GB. Provides ample room for large datasets and multitasking.
- Module configuration: 4096M x 80. Delivers a dense memory layout for optimal performance.
- Memory voltage: 1.25 V. Guarantees stable operation at high speeds.
- Memory data transfer rate: 5600 MT/s. Offers rapid data movement for intensive workloads.
- CAS latency: 36. Balances speed and timing for responsive computing.
- ECC: Yes. Detects and corrects errors to keep your data safe.
- On-Die ECC: Yes. Adds an extra layer of error correction within each chip.
- Cooling type: Heatsink. Helps maintain temperature during heavy use.
Usages of a 256 GB DDR5 DIMM
Ideal for data scientists, engineers, and creators who run simulations, virtual machines, or large-scale databases, this kit also suits high-end workstations that demand both speed and reliability for professional applications.
Benefits of Kingston Technology DDR5 DIMM
- Data integrity: ECC ensures your work is protected from corruption.
- Future proof: 5600 MT/s speed readies your system for upcoming software.
- Easy upgrade: Plug N Play auto-overclock saves time and effort.
- Thermal stability: Heatsink cooling keeps temperatures low under load.
- Compatibility: XMP 3.0 and AMD EXPO profiles work with major platforms.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row Precharge Time (TRP) |
16 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 80 |
| Memory voltage |
1.25 V |
| Memory ranking |
1 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory data transfer rate |
5600 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
8 x 32 GB |
| Internal memory |
256 GB |
| Buffered memory type |
Registered (buffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 95 °C |
| Sustainability |
| Doesn't contain |
Halogen |
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Weight |
173.6 g |
| Height |
31.2 mm |
| Depth |
133.3 mm |
| Width |
3.8 mm |
| Packaging data |
| Package weight |
190.51 g |
| Package height |
35.6 mm |
| Package depth |
167.6 mm |
| Package width |
104.1 mm |
| Other features |
| Internal memory |
256 GB |
