Tired of lag when you push your PC to its limits? Kingston Technology (KF556C40BBK4128), 128 GB, 4 × 32 GB 5600 MT/s DDR5 DIMM RAM gives you the ultra-fast memory you need for high-end gaming, 4K livestreams and demanding 3D rendering, keeping your system responsive and stable.
Kingston DDR5 RAM
Many buyers worry about compatibility and whether high-speed kits will stay stable under load. Some also fear that over-clocking features are too complex to use. This kit removes those doubts - it follows JEDEC standards, includes Intel XMP 3.0 and AMD EXPO profiles for easy tuning, and features on-die ECC for reliable performance at extreme speeds.
Key Features of a 5600 MT/s DDR5 RAM
- Memory speed: 5600 MT/s. Delivers rapid data transfer for smoother gameplay and faster rendering.
- Capacity: 128 GB (4 × 32 GB). Provides ample room for large projects and multitasking without slowdown.
- CAS latency: CL40 (40-40-40). Balances speed and timing for consistent performance.
- On-die ECC: Yes. Helps maintain data integrity when you push the memory to its limits.
- Dual 32-bit subchannels: Yes. Improves efficiency by handling more data simultaneously.
- Voltage: 1.25 V. Optimised power use while supporting high frequencies.
- Heat spreader: Low-profile black design. Keeps temperatures down without adding bulk.
- XMP version: 3.0. Allows one-click overclocking on compatible Intel platforms.
- AMD EXPO: Certified. Ensures easy tuning on AMD systems as well.
Usages of a 5600 MT/s DDR5 RAM
Ideal for gamers who run ultra settings, content creators editing 4K video, engineers running complex simulations, and anyone building a future-proof PC that can handle the most demanding applications.
Benefits of Kingston DDR5 RAM
- Stability: On-die ECC protects your data during intense workloads.
- Simplicity: XMP 3.0 and AMD EXPO profiles make performance upgrades effortless.
- Longevity: High-quality components and a lifetime warranty give peace of mind.
- Efficiency: Dual subchannels and low power draw keep energy use in check.
- Cooling: Integrated heat spreader maintains optimal temperatures for reliable operation.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| SPD speed |
4800 MHz |
| SPD latency |
39 |
| SPD voltage |
1.1 V |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 64 |
| Memory voltage |
1.25 V |
| Memory ranking |
2 |
| Memory channels |
Quad-channel |
| CAS latency |
40 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
5600 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
4 x 32 GB |
| Internal memory |
128 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
138.36 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package type |
Blister |
| Package weight |
201.99 g |
| Package height |
171.4 mm |
| Package depth |
25.4 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
128 GB |
