Tired of lag when loading the latest games or demanding AI apps? You need memory that keeps up with today’s DDR5 platforms, and the Kingston Technology FURY 24GB 7200MT/s Renegade Silver XMP, DDR5, 288-pin DIMM delivers exactly that - a fast, reliable 24 GB stick that boosts performance without overheating.
Why Choose Kingston DDR5 Memory
Many shoppers worry about compatibility and whether a high-speed module will stay stable under load. Others fear the heat a fast stick can generate, leading to throttling. This module answers those concerns with Intel-certified XMP 3.0 profiles for easy overclocking, a robust aluminium heat spreader that keeps temperatures low, and full JEDEC compliance for plug-and-play confidence on any supported motherboard.
Key Features of a 7200 MT/s DDR5 Memory
- Memory data transfer rate: 7200 MT/s. Provides the bandwidth needed for modern games and AI workloads.
- Capacity: 24 GB. Gives ample room for multitasking and large applications.
- Memory voltage: 1.45 V. Optimised power draw for stable operation at high speeds.
- CAS latency: 38. Balances speed and responsiveness for smoother performance.
- On-Die ECC: Yes. Adds error detection to improve data integrity during intensive tasks.
- Lead plating: Gold. Ensures reliable connections and resistance to corrosion.
- Cooling type: Heatsink. Aluminium spreader dissipates heat, maintaining cool temperatures.
- Dimensions (H × W × D): 39.2 mm × 7.66 mm × 133.3 mm. Fits standard DIMM slots without clearance issues.
- Weight: 45.2 g. Light enough for easy handling during installation.
- XMP version: 3.0. Allows two custom profiles for fine-tuned performance tweaks.
Usages of a 7200 MT/s DDR5 Memory
This 24 GB DDR5 stick is perfect for gamers building a high-frame-rate rig, creators running video editing suites, and professionals needing fast AI or data-analysis processing. It also suits DIY enthusiasts who want a sleek silver heat spreader to match their build’s aesthetic while delivering top-tier speed.
Benefits of Kingston DDR5 Memory
- Reliable performance: Consistent high speeds mean fewer bottlenecks in demanding applications.
- Easy overclocking: XMP 3.0 profiles let you boost performance without complex settings.
- Cool operation: Aluminium heat spreader keeps the module running at safe temperatures.
- Future-proof capacity: 24 GB ensures you have room for upcoming software and games.
- Peace of mind: Gold plating and on-die ECC protect against connection issues and data errors.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
3072M x 64 |
| Memory voltage |
1.45 V |
| Memory ranking |
1 |
| CAS latency |
38 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
7200 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
1 x 24 GB |
| Internal memory |
24 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
45.2 g |
| Height |
39.2 mm |
| Depth |
133.3 mm |
| Width |
7.66 mm |
| Packaging data |
| Package weight |
100.13 g |
| Package height |
171.4 mm |
| Package depth |
16 mm |
| Package width |
129.5 mm |
| Other features |
| Internal memory |
24 GB |
