Struggling with lag in the latest games or slow renders in demanding software? Upgrade your system with Kingston (KF552C40BBK2-32) FURY Beast 32GB 2 × 16 GB 5200MT/s DDR5 DIMM RAM - a high-speed memory kit designed to keep up with next-gen workloads and give you smoother performance when it matters most.
Why Choose Kingston DDR5 RAM
Many buyers worry about compatibility and whether a memory kit will really boost performance without causing instability. Confusion often arises around overclock profiles and the need for extra cooling. This kit removes doubt by offering Intel XMP 3.0 and AMD EXPO certified profiles, on-die ECC for data integrity, and a low-profile heat spreader that fits most builds while staying cool.
Key Features of a 5200 MT/s DDR5 RAM
- Memory data transfer rate: 5200 MT/s. Delivers fast data movement for gaming and creative apps.
- Capacity: 32 GB (2 × 16 GB). Provides ample room for multitasking and large projects.
- Memory voltage: 1.25 V. Optimised power use for stable operation at high speeds.
- CAS latency: 40. Balances speed and responsiveness for smoother gameplay.
- On-Die ECC: Yes. Helps maintain data accuracy during intensive tasks.
- Dual 32-bit subchannels: Improves efficiency in handling simultaneous data streams.
- Heat spreader type: Heatsink, low-profile. Keeps temperatures down without taking up space.
- XMP version: 3.0. Enables easy one-click overclocking on compatible boards.
- EXPO certified: Yes. Guarantees compatibility with AMD platforms for flexible builds.
Usages of a 5200 MT/s DDR5 RAM
Ideal for gamers pushing ultra settings, streamers broadcasting in 4K+, and creators running heavy 3D rendering or animation workloads, this memory kit ensures the system stays responsive and ready for any demanding scenario.
Benefits of Kingston DDR5 RAM
- Stability: On-die ECC maintains data integrity, giving you confidence during long sessions.
- Performance: High 5200 MT/s speed reduces load times and improves frame rates.
- Compatibility: XMP 3.0 and EXPO profiles work with both Intel and AMD platforms.
- Cooling: Low-profile heat spreader provides effective thermal management.
- Future-proof: DDR5 architecture with double banks and burst length supports upcoming software demands.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
2048M x 64 |
| Memory voltage |
1.25 V |
| CAS latency |
40 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
5200 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 16 GB |
| Internal memory |
32 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
67.48 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
32 GB |
